Past Meeting Presentations
Past meetings' presentations are provided when given to us. The presentation should not be distributed without the approval of the speaker. ( If you want more information on these, please contact the appropriate speaker.)
Past Meeting Presentations
Past meetings' presentations are provided when given to us. The presentation should not be distributed without the approval of the speaker. ( If you want more information on these, please contact the appropriate speaker.)
February 2024
The Chicago chapter was treated to
a presentation by two industry leaders, Jason Smith, Absolute EMC and Gabe Alcala,
Advanced Test Equipment Corp to "The Future of HV EMC
Testing". Due to the tornado, Gabe did not do his presentation,
we hope to reschedule Gabe another time.
The presentation, hosted by DLS covered the ever evolving standards as more and
more Electric Vehicles (EV) are in use.
They discussed the newest release of ISO 2198-2, how it evolved and the
requirements. Jason Smith's presentation is here.
October 2023
The
SAE and IEEE EMC Chicago chapters welcomed another annual Oktoberfest social and
technical
meeting where members, guests, and interested attendees came together for a
festive evening of
conversation and professional networking. We had good food, refreshments,
learning, and more,
This annual event was hosted by the good folks at Elite Electrical Engineering.
September 2023
Tom Braxton presented at Oakton Community
College an excellent presentation to students and our chapter "Stopping
Radio Interference for Fun and Profit". This presentation was well
attended with dinner provided by the Chicago chapter.
In addition, Jerry Meyerhoff also put on a demonstration with many students
staying well after the meeting to participate. Everyone left with
pizza for a late night EMC snack.
The presentation is <here>
December 2021
Bob Straetz, Department of Commerce
Presented to our chapter how Brexit has changed and how it has
created changes in business conditions that US companies need to be aware
of. No
longer will products going to the UK just need to meet Single Market
rules, Brexit has brought about changes involving CE marking, regulations,
logistics, and tariff and VAT rates that US Companies should be familiar
with. The presentation is located here.
September 2021
Tom Braxton, IEEE EMC Society Board of
Directors
Presented to our chapter (as well as others on-line) EMC - was there
a beginning?
The stories of ambition, salesmanship, and resourcefulness give a colorful
backdrop to our work in EMC In many ways, EMC Practices can be traced back
to the very beginning of the radio art. Tom's presentation is located here!
This talk related those stories and gave a deeper perspective on the often
unappreciated work of the EMC Engineer
May 2021
The Chicago Chapter, in cooperation with the
IEEE, the EMC Society, C63, and 11(!) chapters sponsored this meeting. NEW
ASC C63® Wireless and ISM Equipment Measurement Standards: Working Group Chairs
Provide Update on Wireless Power Transfer and Lighting Devices.
Wireless Power Transfer, Emerging Applications, and ANSI C63.30
RF Lighting EMI Measurements Techniques Update: A 21st Century View of LED
and other lighting per ANSI C63.29
Speakers included:
Travis Thul, White House Fellow, Washington DC
Ernesto Mendoza, Standards and Regulations Americas EMC/EMF Senior Policy
Manager, Signify, Rosemont, IL
Our Host and Moderator was Bob DeLisi
March 2021
One of our own, Steve Laya, from Elite Electronic Engineering, Inc.
was our keynote speaker. Steve presented the latest news covering regulatory rules and requirements for wireless enabled devices and digital devices. The presentation is based on recent TCB Council and European Union REDCA meetings held remotely this past October-2020.. The bi-annual TCB Council/REDCA technical conferences covered 4-5 days of presentations on a wide range of compliance topics. This Elite webinar will condense the information down to the highlights applicable to the more common types of wireless devices. The webinar content highlights include:The presentation
is located <here>
November 2020
This was a multi-Chapter event with the
Chicago, Southeastern Michigan, West Michigan, and the Twin Cities Chapters
participating in this event.
Professor Seungyoung Ahn from KAIST presented Electromagnetic Compatibility for
Wireless Power Transfer. The presentation
is located
<here>
July 2020
Scott Lindberg presented an
overview of using a silicone rubber packaging technology to solve EMI/RFI,
transient issues and more in standard connectors for applications in
Defense/Military, Aerospace, Space, Medical and more.
The presentation is located <here>
May 2020
The live May meeting
was cancelled due to the Covid 19 situation, and changed to on-line.
Our presenter was Gabe Alcaala from of Advanced Test Equipment
Corporation. Gabe did a great job presenting "INTRODUCTION TO RF
SAFETY TESTING (w/5G NR UPDATE") Please email Gabe for a copy of his
presentation at galcala@atecorp.com
PDH credit hour form is located here. <click>
April 2020
The live April meeting
was cancelled due to the Covid 19 situation, and changed to on-line. This
was sponsored by ETS-Lindgren,
another milestone
for the Chicago chapter.
Our presenter was Garth D'Abreu, Director, ETS-Lindgren.
Garth presented EMC Measurement Test Challenges of Autonomous Vehicles.
The presentation is located here: EMC
Measurement Test Challenges of Autonomous Vehicles
February 2020
Our February meeting was
hosted by Elite Electronic Engineering, with Louis Feudi our Presenter.
The presentation is located here: http://www.emcchicago.org/pres/2:13:20_LFeudi.pptx
Contact information is lfeudi@raymondemc.ca
June 2019
Our June meeting was
hosted by DLS Electronic Systems, with Cory Bradshaw our Presenter.
The presentation is located here: http://www.emcchicago.org/pres/6.27.19_C_Bradshaw.pdf
Contact information is cbradshaw@dlsemc.com
April 2019
Our April meeting
was presented by Joanna (Hill) Mclellan, Painless EMC Productivity
Location of presentation is here: http://www.emcchicago.org/pres/4.16.2019_Joanna_McLellan.pdf
Contact information is Joanna (Hill) Mclellan, Painless EMC Productivity, http://www.emcproductivity.com/
November 2017
Our November meeting was
hosted by Shure
Michael Petterson presented, Shure
Unidyne Microphone - its remarkable history. Introduced
in 1939 and still being manufactured today, the Shure Unidyne was the first
unidirectional microphone using a single dynamic element. The
presentation provides an overview of the Unidyne’s unique position in the
history of 20th century broadcast, politics, and entertainment, plus
the amazing story of the 24 year old immigrant from the Ukraine who invented the
Unidyne and earned his first of over 100 patents for audio technology.
Employed by microphone manufacturer Shure Incorporated since 1976, Michael is
the Director of Corporate History. He is a contributing author to the
1,550 page reference tome "Handbook for Sound Engineers – Third/Fourth
Edition." He has presented technical white papers to the Audio
Engineering Society, National Association of Broadcasters, Acoustical Society of
America, National Systems Contractor Association, European Institute of
Acoustics, Voice of America, and White House Communications Agency. In
2014, he authored the definitive history of the Shure Unidyne Microphone.
Fascinated by music, sound, and audio technology since building a crystal radio
set as a lad, Michael Pettersen has a Bachelor of Arts in Music Theory from the
University of Illinois in 1974.
September 2017
Our September
meeting was a triple-header at DLS
Starting off with a BBQ at DLS, we had two speakers with great topics!
Jim Spangler, Spangler Prototype, presented "Using the PSMA
Database. Power
Sources Manufacturers Association (PMSA) is a non-profit whose members
include manufacturers of power sources and components, academia, and
designers/consultants, all related in some manner to creating and using a wide
variety of electronic power sources. As part of its mission to serve the
industry, PSMA has a database of regulations affecting power sources. This
database differs from others in that it is organized as matrix that includes
region, country, agency, and product type. Jim will give a live presentation of
how the data base functions and how to best use this information in your
everyday occupations.
Our second speaker is
our own Jerry Meyerhoff, of JDM Labs.
A
refreshing look back at the recent IEEE EMC Symposium with Jerry’s unique take
on the programs, presentations, opportunities, flora and fauna that was the 2017
Symposium, held in Washington DC in August. This review will highlight the
symposium and the activities of the Chicago Chapter as well feature areas of
interest in the EMC Society.
Jerry is a senior member of the IEEE EMC society, a
past IEEE distinguished lecturer, and executive committee member in the Chicago
chapter for over 20 years. Jerry is a native son of the Chicago area, having
graduated form Illinois Institute of Technology and working for several years
for Motorola AIEG, and Continental, before starting his own EMC consulting firm
JDM Labs in Buffalo Grove, IL. Jerry was recentlyed cited by the IEEE Chicago
Section for his long servie to the IEEE with the Distinguished Service Award
.
April 2017
One of our best attended Chapter meetings,
hosted by Fermi!
Man-Made Noise and the Impact to Radio
Communications – The Changing Environment, presented by Ed Hare,
W1RFI, IEEE Vice-President of Standards and American Radio Relay League and Greg
Lapin, N9GL. Two distinguished experts in the field of
Electro Magnetic Compatibility examined the rapidly changing environment of
man-made noise and the impact to radio communications. Ed Hare and Greg Lapin
are active radio amateurs and members of the American Radio Relay League. They
presented ongoing work to characterize the modern environment of man-made radio
noise; describe the impact to radio communications; and explain the ongoing work
with regulatory agencies to prevent harmful interference to licensed users of
the radio frequency spectrum.
March 2017
Dave Walen, Federal Aviation Administration - Chief Scientific and Technical Advisor for Aircraft gave an excellent program on Electromagnetic Compatibility, as it referenced Portable discussed electronic devices such as smart phones and tablets which integrate high speed computer processors, electronic cameras, satellite-based position services, and radios to support voice and data communications. In late 2013, US airlines allowed passengers to use their tablets, laptops, e-readers and video players during all phases of flight, but require that passengers turn their phones to "airplane mode" during flight. This change seems inconsistent with the earlier restrictions where passengers had to turn off all portable electronic devices during takeoff and landing. Mr. Walen provided the technical backstory for the electromagnetic compatibility issues addressed to allow use of portable electronic devices during flight today. He described the relationship between portable electronic device electromagnetic emissions and potential interference to aircraft avionics, navigation, and radio systems. He will address recent standards that define how aircraft manufacturers and airlines demonstrate tolerance to portable electronic device electromagnetic emissions.
February 2017
An
excellent presentation from Kris Hatashita was enjoyed by all on Military
electromagnetic compatibility (EMC). Kris' presentation demonstrated that
it is a matter of life and death as modern war-fighters rely on the safe, secure
and reliable functioning of their devices. Military EMC includes aspects of
electronic interoperability that are seldom or never considered in the
commercial realm. This talk presents technical details of EMC consideration in
tactical and strategic military operations. The topics discussed include hazards
of electromagnetic radiation to ordnance (HERO), electromagnetic data security (EMSEC),
counter improvised explosive device (CIED) EMC issues and includes first-hand
experiences of work done in the Afghan theatre.
Kris Hatashita has
been the Electromagnetic Environmental Effects subject matter expert for the
Canadian Army tactical communications group since 2002 where he
Kris has worked at or
with many technology corporations throughout his career
Kris’s career in E3
began in 1985 in the aerospace industry after completing
Kris is the past General Chair of the 2016 IEEE
International EMC Symposium recently held in Ottawa, Canada
November 2016
Flynn
Lawerence from AR-Worldwide presented Multi-Tone Testing.
Traditional
Radiated Immunity testing has been performed by sweeping a single
tone across a frequency range of interest. Recent technologies have
allowed for performing RI testing using multiple tones. Multi-tone
testing has many benefits. While the multi-tone methodology was
initially implemented to increase the speed of immunity testing, it
has been found that this method also improves equipment efficiency,
offers greater flexibility to truly test the equipment (EUT) under
real world threat conditions, and can be fully compliant to
standards. Benefits can also include more efficient use of
finite financial and human resources as well as faster time-to-market
for new and enhanced products. The
presentation is located here at
http://www.emcchicago.org/pres/112016.pdf
October 2016
Nick
Buris from NEBENS presented Antenna Technology
for
MIMO Capable Systems from maximizing Throughput to minimizing
Interference. The
evolution of Shannon's and Friis' formulas to the case of multi-port
Smart Antenna Systems found in WiFi, 4G, 5G and Cognitive Radios.
Some typical operations of these systems such as Calibration, Channel
Estimation, Beamforming and Space Division Multiple Access, will be
outlined. After a brief mention of efforts to modify LOS based
antenna design and testing techniques with quantities like Mean
Effective Gain (MEG) and Envelope Correlation Coefficient (ECC), the
presentation will suggest that Capacity and Throughput be used as the
ultimate performance metrics. Applications and examples of antenna
systems designed with capacity in mind will be shown. The published,
but not yet required, CTIA Test Plan for 2x2 Downlink MIMO and
Transmit Diversity Over-the- Air Performance also was discussed as it
is the first step toward certifying products at the level of
throughput. While this test requires antenna prototypes and
functioning transceivers, the talk will include the description of
modeling to predict the CTIA test plan performance before a prototype
is built. MIMObit, a software simulation tool developed by NEBENS
specifically for studies of MIMO capable wireless systems will be
described. The presentation is located here at
http://www.emcchicago.org/pres/102016.pdf
September 2016
Mike McNatt
from B+B SmartWorx did a great presentation on Networking
He demonstrated how to develop this much needed skill.
Mike pointed out that networking is a skill that every
professional should develop and practice.
His talk covered the nuts and
bolts of networking, and answers the questions of what, why, when and
where, but mainly how. Mike
received his B.S.E.E. from Oklahoma State University and M.S.E.E.
from University of Missouri at Columbia, and has completed post-
graduate courses at IIT. For the past 11 years he has held the
position of Compliance Engineer for B+B SmartWorx. Prior to B+B
he held test and design engineering
positions at Argonne National Labs, Tellabs and BP. Mike has been a
facilitator and lecturer at the Naperville Career Transition Workshop
for the last 10 years, and has presented talks on Networking, Success
on the New Job, and Resume Building. The
event was hosted by Elite Electronic Engineering.
The
presentation is located here at
http://www.emcchicago.org/pres/92016.pdf
November 2015
Mike Caruso
presented HEMP and IEMI phenomena, discuss the HEMP and IEMI threat
models, explain how they threaten the private sector critical
infrastructure facilities and equipment and examine practical and
cost effective solutions for achieving comprehensive protection from
such threats.
Mike
Caruso has over 40 years in the RF shielding industry, now retired
from ETS-Lindgren. The presentation is located here at
http://www.emcchicago.org/pres/112015.pdf The
event was hosted by IIT.
April 2014
Upal
Sengupta presented how wireless power is starting to become
more popular with the increased use of small coil technology,
utilizing inductive coupling in an intelligent manner. The
driving factor for this technology is convenience. Especially
for products that are used frequently, and therefore need frequent
charging. Wireless power makes the charging process as simple
as placing an object on the table. While the technology is just
starting to become common, within a few years many public places,
offices, vehicles and homes will have charging stations installed so
that you won't have to carry your battery chargers with you when
traveling or going to work. Wireless power also enables other
applications that need waterproof construction (such as medical
products, or devices used in the outdoors / harsh environments) to
use rechargeable batteries. Upal Sengupta is an
Applications Manager with the Texas Instruments Power / Battery
Management Solutions Group. Upal joined Texas Instruments in
2004 as an Applications Engineer, has a BSEE from the University of
Illinois and an MSEE from Michigan State University. The
presentation is located here at
http://www.emcchicago.org/pres/ti0415.pdf The
event was hosted by DLS Electronic Systems.
March 2014
Rob
Rowe from AR-Worldwide presented Two great presentations, to the
chapter and sponsored the event. The event was held at Elite
Electronic Engineering in Downers Grove. Rob Rowe presented an
update on IEC 61000-4-3 and how that would affect our testing, and
reviewed the new DRAFT version IEC61000-4-3, as well as a great
explanation of what happens when a power amplifier was driven into
compression. Rob also explained new tools and technologies in
EMI testing, which included Field Analyzers. A special thanks
to Rob for braving the cold to come out to our chapter for this
event.
February 2014
Dennis
Lewis from Boeing had a great presentation on the Impact of Cables
and Connectors on Radio Frequency and Microwave Measurement
Uncertainties. Denis talked about how the most critical part
was often assumed or ignored when making measurements. He also
talked about connectors from a user point of view. The meeting
was held at the IIT Wheaton Campus
September 2013
This
was our kickoff meeting and was held at DLS Electronics Systems.
One of own, Roy Leventhal presented "Accounting for Measurement
Inaccuracies. The presentation included examples related to
passing aircraft EMC regulations for disturbances and IEC 61000 for
Immunity. For a copy of the presentation, please contact
frank@electronicinstrument.com
PDH
credits are available here
April 2013
This
meeting was a joint chapter meeting with the IEEE EMC Society Chicago
Chapter and the Northwest Sub Section of the IEEE Region 4. Our
Angel to the EMC Chapter, Don Sweeney, President, DLS Electronic
Systems presented shielding of products from Radiated Emissions.
Pitfalls the engineer has to deal with were also covered in-depth.
For a copy of this presentation, please contact Don Sweeney at DLS,
(847) 537-6400.
PDH
credits are available here
March
2013
This meeting was a joint chapter meeting with the IEEE, SAE,
IEEE EMC Society, and the Fox Valley Section IEEE and Billy Martin
presented "The Effects of Lightning on Aircraft. Bill
Martin, PE, from Cessna-Textron described the basic physics behind
the aircraft lightning environment, ie the charge accumulation,
leader development, attachment, initial strike, and restrike.
Any questions on this presentation, please contact Steve Laya at
Elite Electronic Engineering at 630-495-9770.
PDH
credits are available here
February 2013
AR
Worldwide presented a new technology in EMI receivers. This
tied in with the actual technology internally. The talk
discussed 140MHz instantanous bandwidth, 32000 CISPR detectors, or
8,000 MIL-STD PEAK detectors as well as a new direction in EMI
testing to reduce times to test EUT's/ This was a well attended
event for our chapter! Nick du Toit was our speaker.
For questions on this presentation, please call Nic at AR-Worldwide
at 215-723-8181.
PDH
credits are available here
Tesla PDH credit (not an IEEE EMC Meeting but PDH Credit is available here
September 2012
Our
speaker was Jerry Meyerhoff from JDM Labs. Jerry had a great
presentation about "Why does my design FAIL EMC and how to FIX
IT!" Jerry introduced 4 quadrants of mechanisms, 3
elements of the actors, and 4 types of coupling. Jerry also
discussed case studies from 6 designs. Jerry is Principal
EMC Consultant, JDM Labs, LLC and received his BSEE from UIC
(University of Illinois at Chicago) with post -graduate studies at
IIT. Jerry can be contacted at jerrymeyerhoff@ieee.org
or by phone at 847-630-2769.) PDH
credits are available here
July 2012
On July
11, the Chicago Chapter held a summer social event with the local
Chapters of the Microwave Theory and Techniques Society and Antennas
and Propagation Society. The event was held at Elite Electronic
Engineering in Downers Grove. The meeting topic - “CTIA
Standards and Introduction to Antenna Pattern Measurement” – was
presented by two highly recognized experts in wireless technology:
Paul Moller, Distinguished Member of the Technical Staff at Motorola
Mobility and Dr. Michael D. Foegelle, Director of Technology
Development at ETS-Lindgren. The technical presentations
on wireless standards and antenna technology included a live
demonstration of antenna pattern mapping systems used for MIMO and
OTA wireless performance evaluations. For details contact
frank@electronicinstrument.com
or by phone 630-924-1600 Related URL is
http://ets-lindgren.com/AMS-8050
March 2012
Our
speaker was Kurt Lane from Coilcraft. Kurt demonstrated to us
different types of inductor types, the differences in the materials,
and discussed filtering in detail. Kurt's presentation
discussed the latest generation of tools for the selection, analysis,
and use of filter inductors. Any questions on the presentation
should be directed to Kurt directly at ksmith@coilcraft.com
PDH credits are available
here
February 2012
The
speaker was Colin Tang, of Laird Technologies and he presented
Advanced Materials and Design for Board Level EMI Shielding using a
variety of materials. Using different types of materials from
solder-attached perforated metal cans soldered to pc boards to
materials used in the industry, he compared the performance from
each. Colin used EMSCAN
in some cases to show the
differences in the about of EMI coming from pc boards. Many
references from his recent book were covered as well.
April 16, 2011
Bob
Hofmann from Hofmann EMC Engineering provided us with an update for
C63 as it relates to new specifications. This was a great
presentation and if you have an interest in this specification, you
missed a great update. Please contact Bob if you want a copy of
this presentation.
March 16, 2011
Roger
Swanberg, DLS Electronic Systems presented design and layout of low
EMI Printed Wiring Boards (PCB) as a low impedance path for your
circuit's return current. This path should be on the Ground and
Reference planes. Sometimes it isn't.... The talk covered what
it takes to produce this Ground or reference plane during the layout
of the PCB. Issues covered included holes and splits in these
planes and effects of PCB trace layer changes.
February
16, 2011
Roy
Leventhal, Leventhal Design & Communications presented EMI-EMC
Theory and Troubleshooting at our first EMC meeting of the year. Roy
demonstrated this with both simulation and real-world examples.
Roy has authored EMI/EMC books and is well respected in the EMC
community, and expert in modeling and simulation of Signal Integrity,
Power Integrity and EMI-EMC. Full presentation here <click
for pdf>
October 20,
2010
Our Annual
combination Oktoberfest and IEEE EMC Society / Fox Valley meeting.
The good folks at Elite Electronic Engineering again hosted this
event with great food and the theme of Oktoberfest! Music /
food and a great meeting by Dr. William Radasky presenting High Power
Electromagnetic threats and the Electrical Power System. A copy
of the presentation will be posted shortly.
August
25, 2010
Dan
Hoolihan, our new Chapter Angel presented to a full room the
discussion of Radiated Emissions Measurements at 1/3/5/10/30 meters.
He described the two principal types of Emissions Measurements in the
world of EMC, conducted and radiated emissions. Dan also
discussed and reviewed many technical papers published relative to
his presentation that were published for the last 35 years. Full
presentation here <click
for pdf>
April
21, 2010
Tom
Millineaux from Milmega presented two presentations to the
chapter.
Demystifying
Radio Frequency Fields and Radio Frequency Components
and
Aiding
the 17025 Laboratory Accreditation Process by Capturing Key
Performance Data on RF Power Amplifiers. The
first presentation looked at situation the great 18th
and 19th
century masters
faced along the uncharted road from static electricity to the
prediction and discovery of RF fields. The story picked up with
Benjamin Franklin’s contribution to static electricity and then
described the ‘great race’ that followed the accidental discovery
that an electric current deflects a compass needle. The talk is
rounded off with an explanation of the working of common RF
components. The second presentation was on RF immunity
standards do not require periodic calibration of the RF amplifiers
used in RF immunity testing. This is justified from a strictly
technical point of view, yet creates the situation where there is no
data on file for the most expensive piece of equipment in the test
set-up. This presentation goes through the key amplifier performance
metrics, and introduces a simple / swift method of capturing key data
that can be held on file as ‘trend-analysis’ data.
March
9, 2010
Dr.
Maradei, new IEEE EMC society President discussed the current status
and the new direction of the future of the EMC Society.
Additionally,
Dr. Maradei discussed modeling of power distribution networks in
printed circuit boards
February
16, 2010
Tom
Revesz from HV Technologies presented updates to IEC Conducted
Immunity Standards Edition 2 updates, 2004-2009, IEC61000 -4-2, -4,
-5, -11 Standards Revisions and their implications to the practicing
engineer. Tom Revesz is the EMC Sales Manager at HV TECHNOLOGIES,
Inc. based in Manassas, VA. He is responsible for North
American sales, service, and support of the EMC-PARTNER & Montena
emc brands of conducted and radiated pulsed transient immunity test
equipment applicable to a broad range of worldwide commercial,
industrial, military, and avionics test standards. Tom has an
extensive technical sales and marketing background in the EMC
Industry, having been affiliated with different manufacturers of
transient test equipment as well as an EMC Test Lab. Tom holds
a BSEET from Cal Poly Pomona and MSB from Johns Hopkins University.
Presentations are too large to email or download - contact Frank
Krozel for a copy
November 19,
2009
This
meeting was a joint meeting with Women in Engineering as well as our
own EMC Society. Sharon Phillips presented "How EMC
Benefits Society". Sharon Phillips is the present
Secretary of the IEEE Chicago Section Executive Committee. She
is a Sr. Member of the IEEE and a member of the Communications
Society, the EMC Society, and IEEE-Women In Engineering. Ms.
Phillips is an RF engineer with a long service history at Motorola
where she first worked in Motorola’s Chicago Corporate Research &
Development organization on development of test systems in the areas
of single-sideband in the land-mobile environment, spectral
efficiency for 2nd generation cellular, and data transmission in the
ISM band indoor environment. Her work impacted NAMPS,
TDMA, GSM, and IEEE802.11 standards development.
October 18,
2009
This
was a joint meeting with the Society of Automotive Engineers (SAE)
and IEEE Electromagnetic Compatibility (EMC) Society, as well as the
Annual Oktoberfest at Elite Electronic Engineering.
The meeting topic has been
selected to overlap the interests of both societies. The keynote
presentation, “Current Commercial Telematics Technology”,
explored the concepts, benefits, technology and innovation behind
real-time monitoring of commercial vehicles and assets through
advanced electronics, GPS systems, and wireless communications.
The speaker was Emad Isaac, Chief Technology Officer for the Morey
Corporation of Woodridge Illinois. As
an added interest, members of the Fox Valley Electric Auto
Association had an electric vehicles at this event.
As with past joint events, this
meeting has an “Oktoberfest” theme and includes dinner,
refreshments, and music. The dinner and background polka music
made for an enjoyable social event and provided a great opportunity
for members of each society to cross-network.
July 15,
2009
Green
Power & The Modern Grid
Jerry Ramie, ARC Technical Resources,
Inc.
The
existing power grid is aging, overloaded, unstable and incapable of
meeting the power quality needs of an Information Economy. This
fast-moving overview of the modern grid, and renewable energy's place
in it, details the problems of the existing grid and the features of
a modern grid architecture that can address these shortcomings. The
various: "roadmaps," proposed to achieve this vision are
presented.
The Federal Government's recently proposed economic
stimulus package contains about $60 Billion for smart grid and green
power investments in the next two years. With this much consensus for
moving forward, the various choices in media to support the Advanced
Metering Initiative are discussed, along with their relative
strengths and weaknesses.
Two major threats to the energy
infrastructure are openly presented, physical and cyber security. The
third major threat that is just emerging is the "reliability"
threat of improper EMC methods and testing in substations and
generation plant. This threat and its remedies will also be explored.
Remaining challenges will be identified and conclusions drawn.
Jerry
is a 26 year veteran of the EMC, communications and power
industries and has authored six books on substation EMC for the
Electric Power Research Institute. (EPRI) He has published articles
on grid modernization and sits on the EMC Committee of the American
Radio Relay League, (ARRL) on the Board of Directors of the Santa
Clara Valley EMC Society, is a voting member of the IEEE-P1775
committee on EMC in BPL installations, a member of the IEEE Standards
Association, an iNARTE-certified EMC technician, Secretary of the
ANSI Accredited Standards Committee C63R on EMC and a Senior Member
of the IEEE. He can be reached at jramie@arctechnical.com
April 22,
2009
Mr. Chaman Bhardwaj
has earned his BSEE degree at Punjab Engineering College, Chandigarh,
India. He has studied additional post-graduate courses in USA, in
semiconductor device physics, fiber optics and RF microwave circuit
design.
At Present,
he is a Senior Engineer, in Global Compliance department at Shure
Incorporated. He has also served as an EMI/EMC engineer at R&B
Enterprises, Megahertz Corporation, US Robotics, 3COM, Member
Technical
Staff EMC Applications Engineer at Texas Instruments, and Senior
EMI/EMC/Quality Engineer at Motorola. He has worked as a
consultant and contractor for defense organizations, to name a few
Hamilton Sundstrand, Honeywell, Bosch Security Systems, Inc., and
Sanmina-SCI. He is a NARTE certified EMC Engineer.
The
presentation covered What are worldwide safety standards for ITE and
Audio Video products? What are principles of safety? What are Energy
Efficiency and Environmental regulations? What are EMI and EMC
regulations? What are EMC directives? What are Interferences sources,
what are RF Immunity criteria? Immunity requirement standards, the
design process, Software considerations, component placements, design
for reduced emissions, common mode and differential mode signals,
Cables, shielding, enclosures, aperture size, pre-compliance,
Pre-compliance tools. A
copy of his presentation is located here <click>
February
18,
2009.
The
competition for interesting and well paying engineering jobs is now
worldwide and is intense. The pressure to outsource routine work is
also intense. EMI-EMC engineering is anything but routine,
particularly if you like problem solving and stay at the top of your
game. EMI-EMC engineering offers just such opportunities and the
chance to make a real contribution to good product design. EMI-EMC
engineering is and will remain in high demand and on the cutting edge
of new product development.
Our presenter, Roy Leventhal presented
examples of typical technical and organizational
challenges in
this field in passing regulatory requirements. Plus, how these
challenges are met with a combination of theoretical, laboratory, and
computer skills.
The talk explained how signal integrity (SI),
power integrity (PI), and EMI-EMC performances affect each other and
how computer-aided analysis facilitates better designs. In SI,
reflections are a possible source of radiated and conducted
emissions. In PI, power - power return voltage bounce are a high
probability source of radiated and conducted emissions. SI, PI and
EMI interact with each other through conduction and coupling
mechanisms. Coupling and coupling mechanisms usually look the same
whether emitting or picking up EMI so a design that doesn't perform
well on emissions usually doesn't perform well on susceptibility.
Mr.
Roy Leventhal is Co-Owner of Leventhal Design & Communications.
He has many years of experience in electronics design and related
fields. He specializes in modeling and simulation, including signal
integrity, EMI, RF circuit design, SPICE, S-Parameter, IBIS,
semiconductor modeling, device physics, quality, component
reliability, and failure analysis. Roy is principle author of the
book Semiconductor
Modeling: For Simulating Signal, Power and Electromagnetic Integrity,
Roy
Leventhal
and Lynne Green,
Springer 2006, ISBN: 978-0-387-24159-3.
Roy earned his MSEE at Illinois Institute of Technology. He performed additional post-graduate studies in semiconductor device physics and in RF microwave circuit design.
During his career, Roy has worked as an RF designer in military electronics, a semiconductor applications engineer (Fairchild and National Semiconductor), a component engineer (GE Medical), a Reliability and Failure Analysis Engineer (Tektronix), a Signal Integrity Engineer (Cadence Design Systems and 3Com), and is currently an EMI-EMC Engineer at Hamilton-Sundstrand on the Boeing 787 program.
Additionally, Roy has had hands-on experience using the following simulators: PSPICE, SABER®, MAST®, Allegro/SPECCTRAQuest®, CST Microwave Studio®, Omega PLUS®, and FLOEMC®.
Roy has served as the IBIS Committee web page Librarian for IBIS model sources and participated in the IBIS subcommittee for model quality. He has taught signal integrity at Cadence Design Systems and 3Com Corporation and has been guest speaker at several IEEE EMC Society meetings. In 2002, Roy was recognized by 3Com management for reducing the high-speed digital design process from multiple prototype cycles to one single cycle.
November 19, 2008. This meeting featured Dr. Stephan Frei, Professor of Electrical Engineering at the Technische Universitat Dortmand in Dortmand, Germany. He discussed methods to improve the reproducibility of ESD tests. ESD reproducibility is a vexing problem for EMC engineers and circuit designers. Dr. Frei draws on his research and experience in ESD phenomena in this presentation. He leads a research group dealing with on-board automotive systems. His work involves model-generation and simulation of cable harnesses, automotive bus systems, automotive electronics, and the effects of ESD on these. He is an IEEE EMC Society Distinguished Lecturer.
October
22, 2008.
This special "Oktoberfest” was hosted by our friends at
Elite, where they offered attendees a special dinner buffet,
food & drinks. This presentation covered the general
function, construction, and composition of EMI filters. Our
speakers discussed the various topologies, ie single stage filters,
T, L, pi, single and dual stage filters. The information
included an explanation of filter attenuation, capacitor impedance
vs. frequency curves, inductor (ferrite) impedance vs. frequency
curves as well as test item impedance considerations. Attendees
learned how to select a filter based on parameters such as topology,
attenuation, packaging, etc. We had two highly regarded
technical presenters for this meeting.
James Price, VP
of Engineering for Corry Micronics, Wexford Pennsylvania , and Bob
Meilleur, Engineering Manager for Corry Micronics, Corry ,
Pennsylvania .
September
29, 2008
Daryl Gerke, PE/NCE, is a partner with
Kimmel Gerke Associates, Ltd., an engineering consulting and training
firm that specializes in EMI/EMC issues. Daryl has a BSEE from the
University of Nebraska, and is a Registered Professional Engineer
(PE) and a NARTE Certified EMC Engineer. Daryl has been
professionally involved with EMC since 1970, and has been a full time
EMC consulting engineer since 1987. He is a Senior Member of
the IEEE, and is active in his home EMCS chapter in Phoenix, AZ.
February
21, 2007
David
Hockanson, Ph.D. is a Senior Staff Engineer with the EMC Design group
of Sun Microsystems, Inc. He discussed the world of EMC/EMI debug and
how it has long been shrouded by a consideration that there must be
some "black magic" associated with eliminating system
compliance issues. Using physics and signal analysis, logically
developed solutions can be determined to facilitate EMC/EMI
containment and/or mitigation. This talk facilitated
a discussion on the tools, methods, and process of solving radiated
emissions issues arising during testing.
November
15, 2006
A
Discussion on Double Negative Materials, Transition Boundary
Conditions, Controllable Surfaces, and Design of a New Class of
Metamaterials was presented by Christopher Holloway, National
Institute of Standards and Technology (NIST) Electromagnetics,
Division U.S. Department of Commerce, Boulder Laboratories. Chris
discussed metamaterials theory and applications. He also showed that
the effective permeability and permittivity of composite medium
consisting of insulating magneto-dielectric spherical particles
embedded in a background can be simultaneously negative for
wavelengths where the spherical inclusions are resonant to form a DNG
material. The theoretical results presented showed that composite
media having much simpler structure than those recently reported in
the literature can exhibit negative permeability and permittivity
over significant bandwidths. Click
here for Chris' presentation Additional information can
also be found here..
http://www.interferencetechnology.com/emcnews/id1145
March
21, 2006
Semiconductor
Modeling for High-Speed Digital Circuits: Roy Leventhal
described (from his new book) the following:
A
large percentage of simulation models used for high-speed digital
networks are SPICE transistor level physical models. However, SPICE
models can be a computation burden. IBIS models are also used for
component level simulation and offer the advantage of speed and
simplicity, but they are not meeting current needs for modeling
complex I/O buffers. To expand the capabilities of the IBIS models,
experts in the field of computational electromagnetics are r elying
on macromodeling, AMS modeling and additions aimed at Power Integrity
analysis. IBIS models are being structured with more analysis
capacity so that I/Os with adaptable, adjustable drive levels and
other refinements can be simulated without including excessive
detail. The
paper will present a step-by-step review of how various levels of
simplification (abstraction) are applied to transistor level physical
models resulting in behavioral models, macromodels, and
equation-based models. Participants will see how to achieve the
best speed versus accuracy trade-off of simplicity versus detail that
is balanced to their needs. The session concludes with a brief
introduction to Cadence Design Systems, Inc., macromodeling
templates. Roy Leventhal is an independent trainer and contractor
with 45 years of engineering experience specializing in EDA modeling
and simulation for signal integrity, power integrity, and EMI. Roy
has a background in RF circuit design, IBIS, SPICE and
Scattering-Parameter semiconductor modeling, device physics,
component reliability, and failure analysis. He earned his BSEE/MSEE
at Illinois Institute of Technology. More recently, Roy took
additional post-graduate courses at the University of Wisconsin –
Milwaukee, concentrating on RF and microwave subjects.
February
15, 2006
Mr.
Hofmann presented information on ANSI C63.5 which is the standard for
determination of free-space antenna factors and the calibration
methods for antennas used in EMC testing. His presentation covered
the various calibration methods, i.e. Standard Site Method, Reference
Antenna Method, and Equivalent Capacitance Substitution Method. He
also provided information on the most the recent document revision
and the significance of the updates to EMC testing.
Bob Hofmann is a member of several ANSI C63
subcommittees and led the 1987 and 1999 revisions of ANSI/IEEE C63.12
on Electromagnetic Compatibility Limits. He worked on the 1991, 1992,
2001, and 2003 revisions of C63 .4 on Methods of Measurement of
Emissions. Bob is a past President and a Life Member of the IEEE EMC
Society and a Senior Member of the IEEE. Bob retired from Bell
Laboratories/Lucent Technologies after 44 years of service. He
represented Bell Labs as chairman of the Information Technologies
Industries Council (ITI) TC-5 EMC Committee from 1990 to 1999. He is
a NARTE registered engineer. He has a BSEE degree from the
University of Florida and an MSEE degree from New York University.
October
15, 2005
Gary
Fenical, Laird Technologies presented the Advancements in RF
Shielding Materials. Gary discussed the higher mechanical reliability
requirements, as well as cost cutting pressures that are driving
electronics packaging engineers to find new and innovative EMC
shielding solutions. This presentation covered key advancements in
shielding technology available today and related developments on the
horizon. Just about every class of shielding product has seen
noteworthy changes. Foam-based products, such as Ultra-Soft Sculpted
Fabric-Over-Foam offer a high degree of compression set performance
with increased shielding over the life of the gasket.
Conductive foams have been developed for low compression load
deflection (CLD), lower closure force, while delivering X, Y, and Z
axis conductivity for improved high-frequency shielding. This
makes conductive foam an ideal EMI shielding material in vertical
compression and low cross-shear applications .
Conventional shielding and RF gasketing materials no longer meet the
performance requirements of today’s electronics. Miniaturization
and ever increasing frequencies have contributed to the need for
change. Electrically conductive elastomers which can be produced in
extremely small profiles can be deposited onto small substrates; they
are fast becoming the answer to the miniaturization dilemma.
The need to reduce costs but not performance, while at the same time
increasing geometric complexity, has led to the development of much
more versatile and higher performance EMI products. Metal-Mold
in Place (MIP) and Rotary Form in Place (FIP) provide small intricate
gaskets, unique geometries, minimal footprint, and excellent
shielding. Frameless vent panels greatly improve cooling
capability with no reduction in shielding while providing a more
robust cost effective solution.
March 15,
2005
This
presentation was on the latest update to the European EMC Directive.
A comprehensive look at the recent changes to the directive, the date
for implementation, how it will effect test methodology, test
reporting, testing procedures, and testing laboratories, as well as
the requirements for existing products already on the market.
The
presenter was Donald L. Sweeney, Senior EMC Engineer and President
and founder of D.L.S. Electronic Systems, Inc, an independent
compliance testing and consulting company. He is a graduate of the
Department of Electrical Engineering, University of Illinois at
Champaign Urbana, and has over 40 years experience in the EMC and
electrical engineering fields. Mr. Sweeney specializes in EMC, RFI,
and EMI consulting and testing. He has taught EMC at the University
of Wisconsin, and at Oakton College. Mr. Sweeney has served as a
special consultant to Lawrence Livermore National Laboratory, and the
Nuclear Regulatory Commission. Mr. Sweeney is a member of IEEE EMC
Society, currently on the IEEE EMC Society Board of Directors, and is
past Chapter Chairman for the Chicago chapter of the IEEE EMC
Society. Mr. Sweeney is the founding chairman of the U. S. Council of
Independent Laboratories. For additional details, please
contact the speaker,
Donald L. Sweeney of DLS at
847-537-6400.
February
15, 2005
The Presentation
"EMC Testing of Substation Products" concerns the EMC
testing requirements for products that are installed in Generation or
Substation plants here in the US or in Europe. The Generic EMC
Standards for Substations (CIGRE 36.04, NEMA ICS-1 and IEC 61000-6-5)
are discussed and their similarities are pointed out in detail. A
fuller view of the testing requirements for Protective Relaying
equipment is presented, and a run-down of the required tests is
given. The future growth potential of utility products is very bright
and these tests will be run more often than in the past. Many
manufacturers will need to become acquainted with these Standards to
access this growing market. Their products will be evaluated using
these types of tests and the reliability of the finished Utility
installation will be affected by how well their products perform on
these tests. Anyone that needs to install control products into
Substation settings will be tasked with accrediting products to these
Standards eventually. Additional questions, please contact
Jerry Ramie, ARC Technical Resources.
November
15, 2004
Emissions
Measurements Using Grid Array of Near Field Probes..
Emscan
technology applies a grid array of small H-field probes embedded
in
an 8 layer circuit board covered by a protective surface upon
which the PCB
to be tested is placed. The array of antennae and
electronic switching
achieve high-speed measurement of the current
flows on populated printed
circuit boards. The user can
visualize real time emission hot spots in either a spectral
or
spatial format and utilize the information to identify problem
areas and
possible solutions. This presentation will include a
demonstration of the
technology.
Speaker:
Doug McKinnon, EMSCAN Corporation http://emscan.com/
April
10, 2004
Update
on Ferrite Technology
This
presentation reviewed and discussed the most recent advances in
Ferrite component technology. Areas addressed included ferrite
component use and installation techniques, as well as effects of
temperature on permeability and frequency response. Also reviewed
were advances in materials technology as changes in manufacturing
methodology and material morphology provide enhanced product
performance. The presenter was John Horner of the Fair-Rite
Corporation. John is a member in good standing with the IEEE EMC
Society, and is a past presenter at the IEEE International Symposium
on Electromagnetic Compatibility as well as a presenter at the IEEE
EMC Society Chicago Chapter Mini Symposium on EMC. John currently
holds the position of Sales Manager of Fair-Rite Products and has
over 21 years experience in the field of EMC
March
10, 2004
Calibration
of RF Field Probes from 10kHz-40GHz
RF field
probes play a vital role in EMC test laboratories where RF immunity
testing and measurements of electric field strength are performed.
This meeting will feature a discussion on methods for calibrating,
use, and performance of RF Field probes. The presenter did an
overview of the IEEE 1309 specification and provided a description of
the various types of probes including: single & multi-axis
monopoles, orthogonal dipoles, single dipole antenna probes, and
laser/crystal elements. The various calibration methods will be
reviewed, such as TEM Cell, strip line, Tri-plate, GTEM, discrete
antennas, open-ended waveguides, standard gain horn antennas,
mode-stirred chambers, and OATS vs. anechoic site. The
presenter also described probe calibration parameters such as
frequency response, linearity, channel match, and isotropic
response. Finally, the discussion covered parameters affecting
calibrations, probe usage in the lab, and finally measurement
uncertainty. Jack Andrews has worked for many years as an
EMC engineer and is currently employed by Liberty Labs.
February
12, 2004
An
Approach to Board Level Suppression
This talk covered the setup
and operation of a low cost suppression site. It showed an
approach to setting up and using a site for identifying and
suppressing EMI signals from small electronic devices or systems.
These emissions can be identified by means of a systematic, organized
approach down to the device and pin level where suppression
techniques can then be applied.
Roger
Swanberg is a NARTE Certified and EMC Engineer Senior EMC Engineer
working at D.L.S. Electronic Systems, Inc. He is a Graduate of
the Illinois Institute of Technology in Chicago and has held various
positions in the Electronic Engineering field for over 40 years. As
EMC and Electronics Design Engineer, Roger worked for Motorola
Consumer Products and Zenith Radio in Color TV design, Nuvatec Design
Consulting as EMC designer and Manager of EMI Testing Services, US
Robotics as Regulatory Compliance and Engineering Support Manager,
Motorola Lighting and Motorola Cellular as EMC and Electronics
Designer. He
is presently Vice-Chair for the IEEE EMC Society and Secretary for
the IEEE 2005 Symposium in Chicago. For additional information on
this presentation, contact Roger at 847-537-6400.
November
19,
2003
Conducted
Immunity Transient Testing for CE Marking
This
seminar provided a background knowledge of the IEC and EN standards
used for EMC conducted transient immunity testing for CE marking of
electrical and electronic products. The phenomena behind the
transients plus verification techniques for the transient pulses was
discussed. Special emphasis was given to the requirements for
EN 60601-1-2, the Medical Electrical Equipment EMC requirements and
tests as related to conducted immunity. Pending changes to the
conducted immunity requirements for medical equipment are outlined so
that the EMC engineer can be prepared to implement these new
requirements in a timely manner. Thomas C. Moyer graduated from
Drexel University in Philadelphia with a BSEE degree. He has
worked for Ford Motor Company designing automotive electronics
systems and for Ametek U. S. Gauge designing aircraft engine
instruments. More recently, he has been a sales engineer and
regional sales manager. He joined Amplifier Research in 1996 as
a product line
marketing specialist. For additional
information, Tom can be reached at 215-723-8181.
October 14, 2003
This
event was a joint meeting of the Chicago Chapters of the IEEE EMC
Society, Society of Automotive Engineers (SAE), and the Institute of
Environmental Science and Technology (IEST).
Norman Traub ,
Director of Electrical Initiatives , SAE International discussed 42
Volt DC Systems. This
presentation outlined efforts by the automotive community to provide
a degree of standardization to the process and defined some of the
technical challenges facing implementation in production vehicles
including the impact of 42V on electrical arcing of contacts.
Norman L. Traub is the SAE
Director of Electrical Initiatives, including the 42V Initiative.
Traub has lectured extensively on 42V electrical systems, including
the SAE World Congress, International Power Electronics Conference,
International Society of Automotive Transportation and Technology. He
is a member of the MIT/Industry Consortium on Advanced Automotive
Electrical/Electronic Components and Systems (50 multi-national
companies). He is also the chairman of the SAE 42V Advisory
Committee. Traub received his MSEE from Michigan State University.
February 11, 2003
Mike Windler, Underwriters Laboratories discussed the summary of recent efforts conducted under the auspices of the American National Standards Institute (ANSI) Accredited Standards Committee C63, Sub-Committee 1, working group 1-13.2. The main purpose of this group is to assess the applicability of low-frequency site qualification methodologies, prescribed in current domestic and international standards (e.g. CISPR, ANSI) to frequencies above 1 GHz. A new measurement procedure, which uses presently available equipment and should fully evaluate all types of facilities, has been derived. Conceptually, this procedure is a rotational pattern comparison of an antenna in a reference site to the same antenna in a test site . Michael J. Windler is an Associate Manager responsible for the operation of the EMC laboratory of Underwriters Laboratories Inc. in Northbrook IL where he has worked since 1985. Any questions, call Mike at 847-664-3409
December
11, 2002
Our
"First Holiday" Party was held at "Dave &
Busters". Attended by over 50 people, this seems like it
will continue in the future! Several people went home with gift
certificates certainly welcomed at this time of year. See you
next year!
November
20, 2002
Mike
Howard of Liberty Labs discussed the calibration of a dipole antenna
used on an upcoming satellite mission to the planet Mars, called Mars
Express. The dipole was placed on this satellite and operates
from 1.5 to 5.5Mhz. The dipole is pulsed and will be used to detect
water beneath the perma frost of the surface of Mars. The Mars
Express will be launched atop a Russian Soyuz rocket next June.
October 15, 2002
PCB for EMC was presented by one of our own, Roger Swanberg, of DLS. Roger talked about the fundamentals of designing for EMC when doing printed wiring cards. In addition, how to do the design right the first time. For details on this presentation, please call Roger at DLS, at 847-537-6400.
September 18, 2002
This was the kickoff meeting for the chapter! Chapter President Ray Klouda had various different speakers discussing the IEEE EMC International Symposium in Minneapolis, and trends that are in the industry. In addition, plaques were delivered to Jack Black (2001) and Frank Krozel (2000) for "Person of the Year! (Congrats Jack) and Frank Krozel. Tom Braxton discussed 2005 at Navy Pier, and that is moving along very well! Roy Leventhal discussed EMI Simulation Sources and went into great detail on resources available to all. The meeting closed with a great CD of Don White discussing war stories of EMC as related to the Society in Washington DC. Jack Black ended the meeting with his own war stories of Montreal. This venue seemed to appeal to all there.
April 17, 2002
Jim Muccioli, a NARTE certified EMC and ESD engineer from Jastech EMC Consulting , X2Y, discussed broadband capacitor performance through Inductance Cancellation... The presentation included an overview of X2Y capacitor technology which utilizes unique internal layered circuit architecture. The device is applied for RF shielding, decoupling, noise suppression, transient voltage suppressions and is designed to reduce the number of standard capacitors, inductors, ferrites, and other passive elements used in a circuit.
March 26, 2002
Dwayne Davis, Associated Research, Inc.,Technical Services Manager, discussed applications and analysis covered by EN 50191. In addition he covered what methods can be employed to meet this new standard. EN 50191 covers virtually every aspect of setting up a safe work station. He is a recognized expert in the field of electrical safety testing and its application.
February
20, 2002
Jerry
Meyerhoff, (847-480-5886) Principal Staff Engineer, Motorola
Automotive, explained the application of computer modeling,
simulation, and EMC analysis techniques to better understand the
EMC behavior of electronic systems. He presented his experiences
in EMC troubleshooting and demonstrated the useful and practical
application of computer modeling and simulation techniques. The
discussion drew from examples of automotive electronics, however the
techniques have wide applicability to electronics in all
industries.
December
12, 2001
Dave Hurd,
LeCroy Corp (630-258-2301), covered the measurements of interest for
designers of switchmode power conversion circuits and devices. With
the goal of high efficient and reliable designs, he presented the
acquisition of voltage and current, their relationship in switchmode
power conversion circuits, and the analysis of power devices to
perform accurate analysis while the power transistor or diode is
operating in the non-ground referenced primary circuit of an off-line
switchmode power supply. Instrumentation requirements such as
overdrive recovery, high frequency common mode rejection, and
channel-to-channel time delay matching were covered. A unique
technique was covered for using information contained in the pulse
width modulation signal to find a power circuit’s step response and
soft start performance.
November
14, 2001
Werner
Schaefer, Cisco Systems, Inc. Presented an exciting seminar on
Receivers, and interpretation of signals, IF detectors, and
dynamic range. This also includes a discussion of
specifications like dynamic range IF bandwidth specifications which
are not called out in the standard.
October
17, 2001
Kurt
B. Fischer, Hyper Corporation discussed the Bluetooth Wireless
Technology including what is Bluetooth Wireless Technology, how to
qualify a Bluetooth component, radio module, or end product (process
overview), how to test to the RF test specification, what is
the Bluetooth qualification test facility application and approval
process, validation of test instruments and test systems ---
why is validation important? Kurt included a complete process
that the Bluetooth manuacturers need to go through to get the product
to market. Copies of Kurt's presentation are available my
e-mailing Frank
Krozel.
April
18, 2001
Mike
Windler, Associate Managing Engineer, EMC Lab, Underwriters Labs
(847-272-8800) discussed the techniques for EMC measurements used
with antennas above 1
GHz have been gleaned from methods used at
lower frequencies. The
assumptions made in applying these
techniques have not been completely
validated. This analysis will
compare antennas for use above 1 GHz, showing
ramifications from
use of each type. Measurement methods used above 1 GHz
as
well as the effects of antenna parameters such as antenna
pattern,
beamwidth and polarization will be reviewed. Several
commonly available
antennas will be measured and their results
studied. Frequencies from 1 to
18 GHz were considered.
February
21, 2001
Horror
stories in Automating EMC Testing was presented by Mike Hart,
President, Quantum Change Systems. A frank discussion of
the pitfalls found when automating EMC measurements. Discussion
includes idiosyncracies of different manufacturers. Issues of
BIOS's. Detecting errors in both commands and implementation.
What to do when nothing works. Verifying your results - and what
happens when your verification does not work either. One good thing
about all these problems - Job Security for the EMC engineer.
Mike Hart has been President of Quantum Change since it's inception,
and previously was President of EMCO Antennas.
February
21, 2001
Ray
Klouda, Sr. EMC Engineer, and Steve Laya, Sales and Marketing
Manager, Elite Electronic Engineering, Inc. (630-495-9770)
presented the Correlation of Radiated Emissions Data in a
Reverberation Chamber at Elite Engineering in Downers Grove,
Illinois.
This presentation described the correlation effort
that’s underway at Elite as a part of the Automotive EMC Lab
Recognition Program (AEMCLRP). Radiated emissions data was presented
for Elite’s new reverberation chamber and for the reference chamber
at GM’s Milford Proving Grounds. The data analysis and correlation
effort presented offered a practical application for the chamber
theory presented at the IEEE-EMC chapter meeting last December at
Lindgren RF Enclosures. This presentation also provided an overview
of the new Automotive EMC Lab Recognition Program that has been
developed by Ford, GM, and DaimlerChrysler.
January
17, 2001
H.
R.(Bob) Hofmann, (630-979-6237) Distinguished Member of Technical
Staff, Bell Laboratories, Naperville, discussed the
introduction on the topic of measurement uncertainty in radiated and
conducted emission measurements. It used simple mathematics to
show how the various components used in making measurements add to
the total measurement uncertainty of the final results.
Bob Hofmann has been with Bell Labs for 43 years, working on EMC
issues for the past 22 years. He is the head of the Lucent/Bell
Labs Corporate EMC Committee. He represents Lucent on ANSI
accredited EMC Committee C63 and various C63 subcommittees, and is
the Lucent representative to and vice-chair of ECMA EMC committee
TC-20. He was the lead editor of ANSI C63.12-1999 and
contributing editor to ANSI C63.4-1991, 1992, and 2000.
December
13, 2000
Joe
Weibler, ETS-Lindgren, ( 630-307-7200) Engineering Manager, presented
an introduction to reverberation chamber technology, introduced the
concepts, concerns and proper use of chambers to those new to the
technology. An outline of the current status of standards and
recent developmental efforts for reverberation chamber technology
also was presented to bring users, and potential users, up to date.
A demonstration of reverberation chamber technology was presented in
the on-site chamber at the Lindgren facility."
November
16, 2000
Jerry
Meyerhoff, Motorola Automotive, (847-480-5686), Principal Staff
Engineer, discussed "Unexpected resonance effects in vehicle
applications.' A case study for radiated RF immunity of
electronics installed in an over-the-road truck. Measured whole
vehicle anechoic chamber lab data was compared to wireframe models
simulated with NEC, the Numeric Electromagnetic Code .
October
25, 2000
Dr.
Clifford Kraft, Lucent Technologies, (630-979-3280) discussed the
effects of a small metal reflector as the reflector moved about the
Fresnel ellipse of an Open Area Test Site.
The effect and the
modeling technique used to determine it was presented.
September 20, 2000
Mr.
Tom Moyer, Electrical Sales Engineer (215-723-8181), Amplifier
Research Product manager for EM Test, Inc. This
presentation reviewed a common and reproducible basis for evaluating
the performance of electrical and electronic products when subjected
to repetitive Electrical Fast Transients or classically known as ...
EFT.
April 26, 2000
Mark Montrose, Principal
Consultant of Montrose Compliance Services, Inc., Senior member
IEEE, current member of the Board
of Directors for
the IEEE EMC Society, and Distinguished Lecturer for the
society.
This presentation illustrated, in simple form, how and
why EMI gets developed within a printed circuit board (PCB) and the
manner in which propagation occurs; radiated and conducted.
Basic concepts are examined to remove the mystery on why problems are
designed into the product, and how one can prevent making mistakes
from happening time and time again.
March
29, 2000
The
Medical Directive - An Update...was
presented by Pat Malloy (215-723-8181), Senior Sales Applications
Engineer, Amplifier Research. This presentation dealt
with Medical Device Directive 93/42/EEC with an emphasis on EMC
compliance. Both the current version as well as the proposed 2nd
edition were covered.
Amplifier Research manufactures power amplifiers from D.C. to 40GHz,
EMC Immunity antennas, ARCell, and a variety of accessories. In
addition, Amplifier Research has a strategic alignment with EM Test,
for Conducted Immunity test equipment.
February 23, 2000
Donald L.
Sweeney, President, D.L.S. Electronic Systems, Inc
(847-537-6400). presented how a manufacturer can use a CAB
to gain access to the European market. The steps that are
needed to comply with the rules. It will also include the
latest news from some of the committees and what is on the horizon as
far as the European Union is concerned. This was a pizza
meeting and all enjoyed the camaraderie, compliments of DLS.
January 26, 2000
Kevin
Baldwin, EMC Test Systems (203-838-4555) presented the Cassper
"Virtual Chamber", and source localization system.
This is a very hot topic for people in need of "minimizing"
ambient signals. The actual system will be demonstrated on
February 29, 2000 at the Holiday Inn in Itasca. ETS, under the
umbrella of ESCO, offers the EMC community RF Shielded Enclosures,
Rantec Anechoic Material and chambers, and EMCO EMC products.
December 8,
1999
Roy Leventhal works at 3Com (847-797-2152) in Mt.
Prospect as a Sr. Signal Integrity Engineer. He earned his BSEE &
MSEE at Illinois Institute of Technology, the latter in 1966. More
recently he was in the PhD EE program at the University of Wisconsin
- Milwaukee before that was interrupted by career moves. His main
area of study was RF and microwave. Roy had in interesting
discussion on Signal Integrity.
3Com manufacturers the
famous Palmtop hand helds, modems for laptop and desktop computers,
camera systems for internet operation.
October 27, 1999
Bob
Hofmann of Lucent (630-979-3627) discussed the round robin of tests
on a radiator that will be shipped around the country, and the
results tabulated and compared. This should provide the EMC
community with some interesting information on OATS, Chambers and
receiver performance reference repeatability. FYI, Bob's
results were resolved down to the hundredth of a DBuV! In
addition, Bob updated us on the FCC's intent of dropping Part
15 and adopting CISPR 22 for Conducted Emissions.
September 29,
1999
Dr. Clifford Kraft of Lucent (630-979-3280) discussed RF
coupling into cables, and the different methodologies that need to be
addressed when attempting to resolve the interference. Many
different guidelines were discussed, like if impedance is low, use
inductors - if the impedance is high, use capacitors.
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